IDA-303-B

IDA-300 series die attach materials are formulated for high transparency and reliability and are electrically non-conductive. Designed to meet varying application requirements and dies sizes, IDA-303-B comprises novel siloxane binder matrix chemistry and is thermally very stable. The cured material has very high transparency and is crack and void free due to solvent-free formulation.

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Applications & Uses:

LED applications

Benefits:

Highly Transparent
Thermally stable
Fast curing
One-component system

Performance Attributes:

Transparent
Solvent free
Good processability
Extremely low bleeding
Solvent free
Curing without voids
Good adhesion to different substrates
Fast curing at low temperatures
Solvent free/100% solids—no VOCs to handle or report
No corrosive by-products
Pb free and RoHS compliant

Approvals & Certifications:

ISO9001 Registered

Manufacturer:

Inkron Oy

Physical Properties:

Appearance:	Translucent (before curing), Clear (after curing)

Chemical Properties:

Viscosity:	5000–10000mPas

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IDA-303-B

Applications & Uses:

Benefits:

Performance Attributes:

Approvals & Certifications:

Manufacturer:

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Physical Properties:

Chemical Properties:

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