Under Layer Material for Bi-layer Lift-off Processing (BLX Series)

In the recent rapid progress of manufacturing ultra-fine semiconductors and flat panels, the processes are increasingly diversified. The ability to rapidly develop suitable materials is needed. We are developing a characteristic photoresists (photosensitive materials) for lift-off processing. Lift-off processing has the advantage of eliminating a metal etching process for wiring, thus contributing to shortening the process time and reducing the amount of material used. We also offer consultation on material development to meet our customers’ individual needs and detailed requirements. Contact us for more information.

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Applications & Uses:

Under layer material for bi-layer lift-off processing
Application examples: Compound semiconductors, optical devices, RF devices, and difficult-to-etch materials

Benefits:

Ideal for a variety of over layer resist applications free of inter-mixing
Various film thicknesses can be designed for over and under layers
The amount of side etching can be adjusted as desired depending on the process conditions
Good easy to be cleaned up
Possible to replace existing material

Manufacturer:

Nagase ChemteX Corporation

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Under Layer Material for Bi-layer Lift-off Processing (BLX Series)

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