IDA-200 series materials have been formulated to provide excellent reflectivity and thermal conductivity while remaining electrically non-conductive. These properties make them ideal for a variety of applications and die sizes. IDA-255 is an advanced adhesive that has been specifically designed for applications requiring excellent thermal conductivity and thin bond lines (<5μm). The unique siloxane binder matrix chemistry and nanofiller matrix coupling technology allow for optimal thermal performance while maintaining a suitable viscosity for dispensing process without tailing or bleeding. This makes IDA-255 the perfect solution for a wide range of thermal management applications.