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In addition to supply shipping tray, stick and case, carrier tape, film and buffer agent for the entire Electronics component packing process up to delivery, Nagase also provides packaging design services and high quality production of vacuum / pressure empty formation and extrusion molding of packaging products.

Its corresponding group companies in Japan and Southeast Asia have the expertise in:

  • Hard disk drive parts packaging
  • Liquid crystal parts packaging
  • SMT / Connector parts packaging

Enquiries are welcome for who needs consultation services in:

  • Clean, conductive packaging material
  • Supply of packaging material for electronic parts to your overseas factories
  • Supply of Japan-made packaging material to anywhere in the world
  • Quality control standard of overseas packaging material supply

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